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| Microwave Ceramics and Modules 2-Pole Filter for W-CDMA Preliminary Data Sheet Filter B69812N2147A360 Features SMD filter consisting of coupled resonators with stepped impedances (NdBa)TiO3 (r = 88 / TCf =010 ppm/K) with a coating of copper (10m) and tin (>5m) Excellent reflow solderability, no migration effect due to copper/tin metallization Index Page 2 Component drawing Recommended footprint, Marking Page 3 Characteristics Maximum ratings Typical passband characteristic Page 4 Processing information Soldering requirements Delivery mode ISSUE DATE 28.06.04 ISSUE P4 PUBLISHER SAW MWC PD PAGE 1/4 Microwave Ceramics and Modules 2-Pole Filter for W-CDMA Preliminary Data Sheet Filter B69812N2147A360 Component drawing View from below onto the solder terminals and view from beside Recommended footprint Marking yww A360 ISSUE DATE 28.06.04 ISSUE P4 PUBLISHER SAW MWC PD PAGE 2/4 Microwave Ceramics and Modules 2-Pole Filter for W-CDMA Preliminary Data Sheet Characteristics min. Center frequency Insertion loss Passband Amplitude ripple (peak - peak) Standing wave ratio Impedance Power Attenuation at 1920 to 1980 MHz fc IL B 60 SWR Z P 30 35 typ. 2140 1.5 Filter B69812N2147A360 max. 2.0 MHz dB MHz 0.5 1.5 50 1.0 2.0 dB 1.0 W dB Maximum ratings IEC climatic category (IEC 68-1) Operating temperature Typical passband characteristic - 40/+ 90/56 Top -40 / +85 C 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 attenuation [dB] 1.8 1.83 1.85 1.88 1.9 1.93 1.95 1.98 2 2.03 2.05 2.08 2.1 2.13 2.15 2.18 2.2 2.23 2.25 2.28 DB[S11] DB[S21] frequency [GHz] ISSUE DATE 28.06.04 ISSUE P4 PUBLISHER SAW MWC PD PAGE 3/4 Microwave Ceramics and Modules 2-Pole Filter for W-CDMA Preliminary Data Sheet Processing information Wettability to IEC 68-2-58: 75% (after aging) Soldering Requirements Profile for eutectic SnPb solder paste Soldering type reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the component) 225 (max. 10 sec.) Recommended soldering conditions (infrared): Temp. [C] within 10 sec. Filter B69812N2147A360 Profile for leadfree solder paste reflow 260 (max. 2 sec.) C 250 (max. 10 sec.) C Temp. [C] within 10 sec. 215C10C 245C5C 20-40 sec. 40-80 sec. Time [sec.] 30 sec. 2.5 C/s 2-3 min. Time [sec.] > - 5 C/s Delivery mode Blister tape acc. to IEC 286-3, PS , grey Pieces/tape: 3000 EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed. ISSUE DATE 28.06.04 ISSUE P4 PUBLISHER SAW MWC PD PAGE 4/4 |
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